Xinyuan shares formally joined the UCIe Industrial Alliance

Published:2022-04-12 Author:Mass Power

April 2, 2022, Shanghai, China -- Silicon Platform as a Service (SiPaaS®) is a leading chip design Platform as a Service (SiPaaS®) announced today that it officially joined the Universal Chiplet Interconnect Express (UCIe) Industrial Alliance.As the first batch of enterprises in mainland China to join this organization, Xinyuan will work with other members of UCIe Industry Alliance to research and apply UCIe version 1.0 specification and the new generation of UCIe technical standards, laying a solid foundation for the development of Chiplet technology and products.

UCIe was founded in March this year by ten companies including ASE, AMD, Arm, Google Cloud, Intel, Meta, Microsoft, Qualcomm, Samsung and TSMC.Consortium members will work together to standardize the Chiplet interface specification and have already released version 1.0 of the UCIe specification.UCIe is an open Chiplet interconnection specification that defines the interconnections between Chiplet within an encapsulation to achieve universal interconnection of Chiplet at the encapsulation level and an open Chiplet ecosystem.

According to the statistics of IPnest [1], SmIC is the first semiconductor IP supplier in Mainland China and the seventh in the world, with the second growth rate among the top seven, and the first two IP types among the top seven.With six processor IP cores including GRAPHICS processor IP, neural network processor IP, video processor IP, digital signal processor IP, image signal processor IP and display processor IP, and leading chip design capabilities, Xinyuan has been committed to the promotion of Chiplet technology and industry in recent years.Based on the two design concepts of "IP chipset, IP as a Chiplet" and "Chip platformization, Chiplet as a Platform", Chipset launched a high-end application processor Platform designed based on Chiplet architecture. At present, the 12nm SoC version of the Platform has been streaming and verified.And is iterating through versions of Chiplet.

"Tablet computers, autonomous driving, and data centers will be the first areas where Chiplet will be applied."Tablets require heterogeneous processor ips with many different functions, data centers integrate many common HPC modules, and car-level Chiplet can greatly improve the iterative efficiency of automotive chips and reduce the potential security risks of a single chip failure."Dai Weimin, founder, Chairman and President of Jiyuan, said, "The efforts made by Jiyuan in Chiplet project over the years not only promoted the industrialization of Chiplet, but also promoted Jiyuan's semiconductor IP licensing business and one-stop chip customization service to a new height."We are likely to be the first in the world to launch commercial Chiplet products for customers."